{"id":4711,"date":"2019-01-09T15:21:11","date_gmt":"2019-01-09T14:21:11","guid":{"rendered":"http:\/\/www.cinam.univ-mrs.fr\/cinam\/?page_id=4711"},"modified":"2020-05-05T13:07:19","modified_gmt":"2020-05-05T11:07:19","slug":"etching","status":"publish","type":"page","link":"https:\/\/www.cinam.univ-mrs.fr\/cinam\/en\/etching\/","title":{"rendered":"Etching"},"content":{"rendered":"
\n\t\n\t\t\n\t\t\t\n\t\t\tPLANETE\t\t<\/span>\n\t<\/a>\n<\/div>\n<\/div><\/div><\/div>
\n\t\n\t\t\n\t\t\t\n\t\t\tNanofab\t\t<\/span>\n\t<\/a>\n<\/div>\n<\/div><\/div><\/div>
\n\t\n\t\t\n\t\t\t\n\t\t\tLithography\t\t<\/span>\n\t<\/a>\n<\/div>\n<\/div><\/div><\/div>
\n\t\n\t\t\n\t\t\t\n\t\t\tDeposition\t\t<\/span>\n\t<\/a>\n<\/div>\n<\/div><\/div><\/div>
\n\t\n\t\t\n\t\t\t\n\t\t\tEtching\t\t<\/span>\n\t<\/a>\n<\/div>\n<\/div><\/div><\/div>
\n\t\n\t\t\n\t\t\t\n\t\t\tMetrology\t\t<\/span>\n\t<\/a>\n<\/div>\n<\/div><\/div><\/div><\/div><\/div>
\n\t

Etching (soustractive fabrication)<\/h3>\t\t\t\t\t
\n\t\t\t\t\t\t
<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n<\/div><\/div><\/div><\/div>
\n
\n\t

\"\"<\/p>\n

Alcaline Wet Etching of Silicon<\/p>\n<\/div>\n<\/div><\/div><\/div>

\n
\n\t

\"\" Examples of anisotrope etching of Si by RIE<\/p>\n<\/div>\n<\/div><\/div><\/div>

\n
\n\t
    \n
  • Wet Chemical<\/strong> Etching (isotropic and anisotropic)<\/li>\n
  • Plasma-assisted Reactive Ion Etching (RIE<\/strong>)\n

    Available gases: CHF3<\/sub> SF6<\/sub> O2<\/sub><\/strong>
    \nEtched Materials : Si SiO2<\/sub> Si3<\/sub>N4<\/sub> TiO2<\/sub> WO3<\/sub><\/strong><\/p>\n<\/li>\n

  • Metal etching by Inductively Coupled Plasma (ICP<\/strong>)<\/li>\n
  • Ion milling by large argon beam<\/li>\n
  • Polymer etching by oxygen plasma<\/li>\n<\/ul>\n<\/div>\n<\/div><\/div><\/div><\/div><\/div><\/div>","protected":false},"excerpt":{"rendered":"

    PLANETE Nanofab Lithography Deposition Etching Metrology Etching (soustractive fabrication) Alcaline Wet Etching of Silicon Examples of anisotrope etching of Si by RIE Wet Chemical Etching (isotropic and anisotropic) Plasma-assisted Reactive Ion Etching (RIE) Available gases: CHF3 SF6 O2 Etched Materials : Si SiO2 Si3N4 TiO2 WO3 Metal etching by Inductively Coupled Plasma (ICP) Ion milling <\/p>\n","protected":false},"author":14,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"page-templates\/full-page.php","meta":[],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/www.cinam.univ-mrs.fr\/cinam\/en\/wp-json\/wp\/v2\/pages\/4711"}],"collection":[{"href":"https:\/\/www.cinam.univ-mrs.fr\/cinam\/en\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.cinam.univ-mrs.fr\/cinam\/en\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.cinam.univ-mrs.fr\/cinam\/en\/wp-json\/wp\/v2\/users\/14"}],"replies":[{"embeddable":true,"href":"https:\/\/www.cinam.univ-mrs.fr\/cinam\/en\/wp-json\/wp\/v2\/comments?post=4711"}],"version-history":[{"count":24,"href":"https:\/\/www.cinam.univ-mrs.fr\/cinam\/en\/wp-json\/wp\/v2\/pages\/4711\/revisions"}],"predecessor-version":[{"id":7443,"href":"https:\/\/www.cinam.univ-mrs.fr\/cinam\/en\/wp-json\/wp\/v2\/pages\/4711\/revisions\/7443"}],"wp:attachment":[{"href":"https:\/\/www.cinam.univ-mrs.fr\/cinam\/en\/wp-json\/wp\/v2\/media?parent=4711"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}